
AOI Inspection
3D AOI checks visible placement, polarity, component presence and solder-joint features. Coverage and limits are confirmed for the selected line and project.
PCB inspection and testing should catch defects at the earliest controllable stage—not wait for final inspection. On a PCBA, that means DFM before tooling, IQC before the line and SPI before reflow. MES traceability and project-specific records are defined across the agreed manufacturing and assembly scope.
Quality Control begins with approved production data and continues through incoming inspection, process control, inspection, testing, final inspection, packing and shipment release.

Incoming Inspection
Check materials, components, labels, quantities, packaging and project documentation.
Process Control
Control fabrication, solder-paste printing, placement, reflow and agreed process requirements.
Inspection & Testing
Apply SPI, AOI, X-Ray, electrical testing, ICT or FCT according to the agreed scope.
Final Inspection
Confirm workmanship, labeling, documentation, packing and shipment-release requirements.
Records
Maintain the agreed production, inspection and test records for the project.
Shipment Release
Release only after final acceptance and packing requirements are met.
Inspection and test methods are selected according to package type, process risk, test access and the agreed acceptance plan.

3D AOI checks visible placement, polarity, component presence and solder-joint features. Coverage and limits are confirmed for the selected line and project.

3D SPI checks solder-paste height, area and volume before placement. The inspection recipe and acceptance limits are defined for the released assembly.

X-ray examines hidden joints beneath BGA, QFN and CSP packages when the agreed inspection plan requires subsurface evidence.

Electrical test or flying probe checks opens, shorts and net continuity. ICT is available with appropriate bed-of-nails or flying-probe coverage.

Functional test, optional aging and boundary scan are selected according to approved procedures, fixtures and acceptance criteria.

Fabrication inspection supports process verification before assembly or final release.
Documentation is defined by the agreed project, facility and sourcing model.
Material lots can be associated with agreed manufacturing and inspection records.
Component records follow the sourcing model and agreed traceability requirements.

Inspection and test reports can be maintained according to agreed documentation scope.

Manufacturing and inspection data supports project-specific corrective-action review.
IPC Class 2 is commonly specified for general industrial and commercial products. IPC Class 3 may be specified for products requiring higher reliability and more demanding acceptance criteria.
The required acceptance class must be confirmed before quotation and production because it may affect design rules, inspection, documentation, yield and cost.
Our PCB quality and environmental management systems are third-party certified. Full details and applicable scope are available on the PCB certifications page.
Manufacturing and inspection requirements are defined before production release.
Inspection and test methods are selected according to package, process and acceptance requirements.
Process and documentation requirements can be carried through approved production release.
Applicable declarations, standards and quality documents are reviewed against project requirements.
Send your acceptance criteria, test procedures and project files for technical review.