Single-sided
Copper on one side for simple power, LED and low-density control boards.
PCB technology / Rigid construction
Rigid PCB Manufacturing (FR4)
Rigid PCB manufacturing provides a stable platform for fixed mechanical assemblies, from single-sided circuits to controlled-impedance multilayer boards.
1–40 layersStandard production
2.5 / 2.5 milTrace / spacing
0.15 mmMechanical drill
±10%Standard impedance
Engineering choices
Match the construction to the electrical job.
Rigid PCB is not one process window. Layer count, copper weight, laminate and via structure change cost and production risk in different ways.
Double-sided
Plated through-holes and routing on both sides—the standard entry point for prototypes.
Multilayer
Internal planes, impedance references and additional routing channels for complex electronics.
Power, thermal or RF
Heavy copper, metal-core and high-frequency materials require their own stackup decisions.
Technical reference
Standard rigid PCB process window
Designs inside the standard window quote faster and carry lower process risk. Advanced combinations still require file-level evaluation.
Rigid and multilayer PCB specifications
Volume production capability for standard builds
| Layer count | 1–40 layers |
|---|---|
| Base materials | FR-4, High-Tg FR-4, halogen-free FR-4, Rogers, Taconic/AGC, PI, aluminum, PTFE/Teflon, F4B and other specialty laminates |
| Board thickness | 0.10–10.0 mm |
| Minimum trace / spacing | 2.5 / 2.5 mil (0.0625 / 0.0625 mm) |
| Minimum mechanical drill | 0.15 mm |
| Minimum laser via | 0.10 mm |
| Standard aspect ratio | Up to 15:1 |
| Copper thickness | 0.5–12 oz, depending on board type and construction |
| Controlled impedance | ±10% standard; ±5% for tighter requirements |
| Warpage | ≤0.75% standard; ≤0.5% available when specified |
| Surface finishes | HASL, Lead-Free HASL, OSP, ENIG, Immersion Silver, Immersion Tin, ENEPIG, Hard Gold, Gold Finger and selective finishes |
Capability values are design-dependent. Material, copper weight, layer count, via structure, finished thickness and surface finish can change the achievable combination.
Design context
Materials and finishes are design inputs.
FR-4 is the default. High-Tg TG170 is appropriate for repeated lead-free reflow or elevated operating temperatures. Controlled-Dk laminates should be confirmed before layout is frozen.
- FR-4 and High-Tg TG170 for general and thermally demanding builds
- Rogers, Taconic and Teflon for RF or controlled-Dk requirements
- Aluminum and ceramic options for thermal management
- ENIG for fine-pitch assembly; HASL for cost-led through-hole designs
FR-4High-Tg TG170RogersTaconicAluminumCeramicENIGENEPIGOSPLead-free HASL
Engineering review
Confirm rigid PCB stackup and fabrication details before release.
Check copper weight, drill geometry, annular ring, stackup balance and target impedance against the selected rigid PCB process.
Trace width and spacing against the selected copper weight
Mechanical and laser drill sizes against aspect ratio
Annular ring and drill-to-copper clearance
Stackup symmetry and copper balance
Target impedance and laminate selection
Special processes including back drilling and via-in-pad
Practical fit
Where rigid FR-4 fits
Use these examples as a starting point. The board construction still follows the product’s electrical, mechanical and qualification requirements.
Industrial control
Fixed-geometry control, instrumentation and motor-drive electronics.
Power conversion
Power supplies and DC-DC conversion, including heavier copper requirements.
Automotive electronics
Control units and supporting electronics built to the specified acceptance criteria.
LED and lighting
Rigid or metal-backed boards selected around the required thermal path.
Consumer products
Appliances and commercial devices with stable mechanical packaging.
Telecom systems
Networking cards and backplanes where stackup and impedance matter.
Frequently asked questions
Rigid PCB manufacturing FAQ
Use these answers to prepare a rigid PCB package for quotation and manufacturing review.
How many layers can you produce on rigid PCB?
Volume production supports 1–40 layers. Prototype and engineering builds can support up to 64 layers; the complete stackup determines feasibility.
What is the minimum trace width and spacing?
The standard process window is 2.5/2.5 mil. Advanced 2/2 mil geometries are evaluated against copper weight, laminate and the rest of the stackup.
What impedance tolerance can you hold?
Standard controlled impedance is ±10%. ±5% is available for tighter requirements when the laminate, stackup and thickness control support it.
Which surface finish should I choose?
ENIG is commonly selected for fine-pitch and BGA assembly. OSP and HASL can be appropriate for cost-led designs, while ENEPIG supports specific bonding and shelf-life requirements.
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