1+N+1
One microvia layer per side for a cost-conscious transition from conventional multilayer.
PCB technology / High-density interconnect
HDI PCB Manufacturing
HDI PCB manufacturing supports fine-pitch escape routing and compact board geometry through laser microvias, sequential lamination and a reliability-focused via structure.
1+N+1–4+N+4Build structures
0.075 mmMinimum laser microvia
2 / 2 milAdvanced geometry
±5%Tight impedance
Engineering choices
Choose the simplest HDI structure that clears the routing.
More sequential lamination is not automatically better. The right structure achieves fanout and signal goals without adding avoidable process risk.
2+N+2
Two sequential lamination cycles for denser BGA escape and more routing freedom.
3+N+3 / 4+N+4
Advanced processors, RF modules and highly constrained interconnect.
Any-layer HDI
Microvia connectivity between layers for designs that cannot use a fixed buildup.
Technical reference
Advanced HDI process window
The values below describe available advanced capability, not a promise that every limit can be combined on one board.
Advanced multilayer and HDI
R&D prototype and high-end HDI builds
| Layer count | Up to 64 layers for prototype / engineering builds |
|---|---|
| Minimum trace / spacing | 2 / 2 mil (0.05 / 0.05 mm) |
| Standard mechanical drill | 0.15 mm |
| Advanced / special hole capability | Down to 0.10 mm, subject to design and process review |
| Minimum laser microvia | 0.075 mm |
| Aspect ratio | Up to 20:1 for qualified designs; 15:1 or below for standard advanced production |
| HDI structures | 1+N+1, 2+N+2, multi-step HDI and Any-Layer HDI |
| Via technology | Blind vias, buried vias, stacked vias, staggered vias, via-in-pad, VIPPO / POFV, resin-filled and plated-over vias |
| Sequential lamination | Supported |
| Any-layer interconnection | Supported |
| Back drilling | Supported |
| Controlled impedance | ±10% standard; ±5% for tighter requirements |
| Warpage control | ≤0.5% available when specified, subject to stack-up and design review |
| High-speed / high-frequency materials | Rogers, Taconic/AGC, PTFE/Teflon, F4B, High-Tg FR-4 and other low-loss specialty laminates |
Capability values are design-dependent. Material, copper weight, layer count, via structure, finished thickness and surface finish can change the achievable combination.
Design context
Microvia architecture must be designed for reliability.
Stacked vias maximize density, while staggered structures can reduce stress. Via-in-pad supports fine-pitch BGA fanout but requires controlled filling and planarization.
- Stacked versus staggered microvia reliability assessment
- Via-in-pad filling and surface-planarity requirements
- Aspect ratio and capture-pad verification
- Reference-plane and impedance continuity through transitions
Laser microviasAny-layer HDIVia-in-padCopper filled viasStacked microviasStaggered microviasENIGENEPIG
Engineering review
Review microvia reliability and lamination strategy before release.
Confirm microvia geometry, capture pads, filling, stacking and dielectric thickness before the HDI production package is frozen.
Microvia stacking and lamination-risk review
Pad size, annular ring and BGA escape geometry
Material thickness control and copper balance
Target impedance and reference-plane continuity
Thermal stress through repeated lamination
Whether a simpler buildup can achieve the same routing
Practical fit
Where HDI solves the constraint
Use these examples as a starting point. The board construction still follows the product’s electrical, mechanical and qualification requirements.
Compact electronics
Wearables and space-constrained consumer devices.
Fine-pitch BGA
Dense fanout for packages at 0.4 mm pitch and below.
High-speed digital
DDR, PCIe and SerDes channels with controlled transitions.
RF and communications
Modules requiring compact routing and controlled impedance.
Medical systems
Portable diagnostic and imaging electronics.
Automotive sensing
ADAS, camera and sensor modules with high interconnect density.
Frequently asked questions
HDI PCB manufacturing FAQ
These answers address common HDI structure, microvia, impedance and manufacturability decisions.
What is the minimum advanced laser drill size?
Advanced HDI builds can use a 0.075 mm laser drill. The capture pad, dielectric thickness and microvia aspect ratio still require stackup-level confirmation.
Can you manufacture any-layer HDI?
Yes, any-layer interconnection is available for designs that need microvia connectivity throughout the buildup. It receives a dedicated engineering and lamination review.
Which HDI structure is most cost-effective?
A 1+N+1 structure is the usual entry point. Engineering should only add sequential layers when escape routing or signal requirements justify them.
How is HDI impedance controlled?
Material Dk, dielectric thickness, copper geometry and finished thickness are modeled together. ±5% control is available for tighter requirements on qualified advanced builds.
Related PCB pages
Compare related PCB technologies and manufacturing services.
Compare HDI with conventional multilayer construction, published process limits, DFM review and prototype validation.
PCB technology
Multilayer PCB (4–40 Layers)
Multilayer PCB manufacturing combines routing density, reference planes and power distribution in a controlled stackup. A 2 layer, 4 layer or 6 layer PCB stackup is selected from the routing, signal and power requirements rather than treated as a duplicate door page.Manufacturing servicePCB Capabilities
PCB manufacturing capabilities vary by material, copper weight, layer count, via structure and finished thickness. Use the applicable process window rather than combining isolated maximum values.Manufacturing servicePCB DFM Review Service
PCB DFM review identifies fabrication, assembly and file-package risks before tooling or production release, with findings tied to the intended manufacturing process.Manufacturing servicePrototype PCB
Prototype PCB manufacturing turns approved design data into production-intent boards for fit, electrical, assembly and engineering validation. Quick-turn PCB fabrication and fast-turn PCB manufacturing options are reviewed against the released package, materials, process requirements and testing plan.Have a board in mind? Let’s define the right build path.
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