Standard rigid and multilayer
The baseline process window for repeatable commercial production.
Manufacturing service / Capability matrix
PCB Manufacturing Capabilities
PCB manufacturing capabilities vary by material, copper weight, layer count, via structure and finished thickness. Use the applicable process window rather than combining isolated maximum values.
1–40 LayersVolume production
Up to 64 LayersPrototype / Engineering Builds
2 / 2 milAdvanced Trace / Space
0.075 mmMinimum Laser Microvia
Any-Layer HDIAdvanced Interconnect
20:1Qualified Maximum Aspect Ratio
±5%Tight Impedance Control
Multilayer and HDI
Tighter geometry, microvias and strict impedance for qualified advanced builds.
FPC and rigid-flex
Flexible materials, coverlay, stiffeners and cycle-life considerations.
Power, thermal and RF
Heavy copper, metal core and controlled-Dk material systems.
Technical reference
Three capability tables, not one blended promise
The most aggressive value in one row may not combine with every other limit. Final capability is confirmed from the complete production package.
Standard PCB specifications
Volume production for rigid and multilayer PCB
| Layer count | 1–40 layers |
|---|---|
| Base materials | FR-4, High-Tg FR-4, halogen-free FR-4, Rogers, Taconic/AGC, PI, aluminum, PTFE/Teflon, F4B and other specialty laminates |
| Board thickness | 0.10–10.0 mm |
| Minimum trace / spacing | 2.5 / 2.5 mil (0.0625 / 0.0625 mm) |
| Minimum mechanical drill | 0.15 mm |
| Minimum laser via | 0.10 mm |
| Standard aspect ratio | Up to 15:1 |
| Copper thickness | 0.5–12 oz, depending on board type and construction |
| Controlled impedance | ±10% standard; ±5% for tighter requirements |
| Warpage | ≤0.75% standard; ≤0.5% available when specified |
| Surface finishes | HASL, Lead-Free HASL, OSP, ENIG, Immersion Silver, Immersion Tin, ENEPIG, Hard Gold, Gold Finger and selective finishes |
Advanced multilayer and HDI
R&D prototype and high-end HDI builds
| Layer count | Up to 64 layers for prototype / engineering builds |
|---|---|
| Minimum trace / spacing | 2 / 2 mil (0.05 / 0.05 mm) |
| Standard mechanical drill | 0.15 mm |
| Advanced / special hole capability | Down to 0.10 mm, subject to design and process review |
| Minimum laser microvia | 0.075 mm |
| Aspect ratio | Up to 20:1 for qualified designs; 15:1 or below for standard advanced production |
| HDI structures | 1+N+1, 2+N+2, multi-step HDI and Any-Layer HDI |
| Via technology | Blind vias, buried vias, stacked vias, staggered vias, via-in-pad, VIPPO / POFV, resin-filled and plated-over vias |
| Sequential lamination | Supported |
| Any-layer interconnection | Supported |
| Back drilling | Supported |
| Controlled impedance | ±10% standard; ±5% for tighter requirements |
| Warpage control | ≤0.5% available when specified, subject to stack-up and design review |
| High-speed / high-frequency materials | Rogers, Taconic/AGC, PTFE/Teflon, F4B, High-Tg FR-4 and other low-loss specialty laminates |
FPC and rigid-flex PCB
Flexible constructions and mechanical qualification
| Layer count | 1–12 layers |
|---|---|
| Flexible materials | PI (Kapton), PET, LCP; High-Tg FR-4 in rigid areas |
| Flexible area thickness | 0.1–0.6 mm |
| Rigid-flex overall thickness | Up to 3.2 mm |
| Copper weight | 1/3–2 oz |
| Minimum trace / spacing | 3 / 3 mil standard; 2 / 2 mil advanced |
| Dynamic flexing | Defined by bend radius, copper, stackup and qualification plan |
| Supported features | Coverlay, stiffeners, ZIF contacts, shielding layers, SMT |
| Testing | Electrical, AOI, dynamic flex and custom testing as specified |
PCB Standard Lead Times
Business-day planning ranges after file and process review
| Product Type | Prototype (1–10 sqm) | Small Batch (10–50 sqm) | Mass Production (>50 sqm) |
|---|---|---|---|
| Double-Sided (2L) | 24–48 Hours | 3–5 Business Days | 7–9 Business Days |
| Multilayer (4–6L) | 48–72 Hours | 4–6 Business Days | 8–10 Business Days |
| Multilayer (8–12L) | 4–6 Business Days | 7–10 Business Days | 10–15 Business Days |
| Multilayer (12–18L) | 6–8 Business Days | 10–12 Business Days | 12–18 Business Days |
| Multilayer (18L+) | 7–12 Business Days | 12–15 Business Days | 15–20 Business Days |
| HDI PCB | 7–12 Business Days | 12–15 Business Days | 15–20 Business Days |
| Flexible PCB | 4–5 Business Days | 6–8 Business Days | 10–14 Business Days |
| Rigid-Flex | 7–10 Business Days | 10–14 Business Days | 15–20 Business Days |
Capability values are design-dependent. Material, copper weight, layer count, via structure, finished thickness and surface finish can change the achievable combination.
Design context
Materials, finishes and special processes
Material selection changes achievable geometry, impedance behavior and thermal performance. Confirm the laminate and special processes before the layout is frozen.
- FR-4, High-Tg FR-4, halogen-free FR-4, Rogers, Taconic/AGC, PI, aluminum, PTFE/Teflon, F4B and other specialty laminates
- HASL, Lead-Free HASL, OSP, ENIG, Immersion Silver, Immersion Tin, ENEPIG, Hard Gold, Gold Finger and selective finishes
- Blind vias, buried vias, stacked vias, staggered vias, via-in-pad, VIPPO / POFV, resin-filled and plated-over vias
- Sequential lamination, Any-Layer HDI, back drilling, controlled impedance and application-specific testing
Controlled impedanceBlind / buried viasLaser microviasVia-in-padBack drillingGold fingersENIGENEPIGHard goldCustom testing
Engineering review
Confirm the applicable PCB manufacturing process window before release.
Match the board type to its qualified process window, then review the combined stackup, drill, copper, finish and testing requirements.
Gerber or ODB++ data and fabrication drawing
Material, finished thickness and copper weight
Stackup and controlled-impedance targets
Via structure and lamination sequence
Surface finish and acceptance class
Testing, inspection and special process requirements
Practical fit
Manufacturing evidence around the specification
Use these examples as a starting point. The board construction still follows the product’s electrical, mechanical and qualification requirements.
Fabrication footprint
PCB fabrication and PCBA operations are coordinated across qualified manufacturing locations. The applicable production site is confirmed during quotation.
Engineering review
Gerber, materials, stackup, geometry, via structure and testing requirements reviewed before tooling.
Production range
Single-board prototype, small batch and volume production paths.
Quality criteria
IPC-A-600 and IPC-A-610 acceptance criteria applied as specified by the drawing.
Quality documentation
Quality-system and compliance documentation is available for applicable manufacturing operations. Request the current certificates and scope during supplier qualification.
Data protection
Confidential file handling and NDA availability for design-data exchange.
Frequently asked questions
PCB manufacturing capabilities FAQ
These answers explain how to interpret published capability values and prepare a build for final confirmation.
How many PCB layers can you manufacture?
Volume production supports 1–40 layers. Prototype and engineering builds can support up to 64 layers, subject to file-level review because geometry and lamination complexity become the governing limits.
What is the minimum trace width and spacing?
Standard rigid production is 2.5/2.5 mil. Advanced builds can reach 2/2 mil, while flexible PCB is 3/3 mil standard with 2/2 mil available.
What are the minimum drill sizes?
Standard production uses a 0.15 mm mechanical drill and 0.10 mm laser via. Advanced and special-hole capability reaches down to 0.10 mm, with minimum laser microvias of 0.075 mm.
How should I use these capability tables?
Use them for early design screening, then submit the complete stackup and fabrication package. Final capability depends on the combination of material, copper, geometry, drilling and finish.
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