Power Electronics PCB & PCBA Manufacturer

The published reference covers 0.5–12 oz copper. Copper weight is selected against your current and allowable temperature rise. Note that heavy copper etches with a trapezoidal profile, so achievable trace width and spacing widen as copper weight increases — our engineers confirm the achievable geometry for your copper weight during project DFM review rather than assuming the standard 2.5/2.5 mil minimum applies.

Aluminum PCB reaches thermal conductivity up to 3.0 W/m·K. For higher power density we also manufacture ceramic substrate. Which one is right depends on your junction temperature target and the mechanical interface to the chassis — send us the thermal requirement with your RFQ and engineering will come back with a recommendation.

Fabrication supports 0.1–10.0 mm board thickness, with 1.6 mm standard and a thickness tolerance of ±0.05 mm on advanced builds. The published PCBA assembly thickness and warpage envelope applies to the relevant assembly route and must be confirmed against board construction and process review.

The PCBA capability reference publishes a 50 × 50 mm to 400 × 1200 mm assembly envelope and a 120 mm maximum component height for applicable process lines. Board support, tooling, clearance and the soldering route are confirmed during engineering review. Wave, selective and hand soldering are available for high-thermal-mass and odd-form joints.

Yes, and it is one of the more common reasons power boards fail DFM elsewhere. The constraint is copper balance and resin fill during lamination. We review copper balance, stackup, and prepreg selection before tooling and will propose a build that holds both the current requirement and the control-side geometry.

For 4–6 layer multilayer PCB: 48–72 hours prototype, 4–6 days small batch, 8–10 days mass production. Heavier copper and metal core builds typically sit at the longer end of the range. All lead times are subject to final evaluation of production files, process complexity, and BOM availability.