Commercial and industrial UAV flight-control, navigation, payload and telemetry boards
Industries / PCB & PCBA
Aerospace & UAV PCB Manufacturer
PCBArise supports customers seeking an aerospace PCB manufacturer or UAV PCB manufacturer for commercial aerospace, drone PCB assembly and eVTOL PCB electronics, including avionics, flight-control, navigation, telemetry, sensing, communication and power boards. Qualification, data handling, end use and acceptance scope are reviewed before technical files are released.
Aerospace ElectronicsUAV ElectronicsAvionics BoardsQualification Review
Application scopeDrone PCB Assembly and Avionics PCB ApplicationsDefined from the released product
PCB buildUAV PCB Construction for Flight-Control Electronics
PCBA routeDrone PCB Assembly and Avionics PCB Applications
Evidence planUAV Quality, Configuration & Data Review
Typical applications
Drone PCB Assembly and Avionics PCB Applications
UAV buyers need a PCB partner around the actual product: flight-control, navigation, payload, telemetry, sensor, power or ground-support electronics. The application and end-use boundary are identified before quotation.
Drone and eVTOL power-management and control electronics
Airborne sensor, data-acquisition and condition-monitoring modules
UAV communication, imaging and payload-interface boards
Ground-control, test and maintenance electronics for UAV programs
Prototype and production electronics with project-specific qualification scope
Engineering choices
What UAV PCB Buyers Need to Qualify
UAV demand is qualification-heavy, but the qualification belongs to the product and customer program. A generic capability statement is not a substitute for an evidence plan matched to the released flight-control or payload electronics.
Flight-control boards combine high-speed digital, RF, sensors and power conversion in a small volume
Weight, vibration, thermal cycling and power integrity constrain the board as one airborne product
UAV and eVTOL programs need configuration control, revision discipline and a clear prototype qualification path
Materials, workmanship, inspection and test evidence must match the customer’s quality system
Traceability and change history follow the approved product and acceptance plan
Data handling, end-use and acceptance requirements are reviewed before files are shared
Technical reference
UAV PCB Construction for Flight-Control Electronics
Rigid, multilayer, HDI, controlled-impedance and high-Tg constructions are considered against the UAV or eVTOL product’s weight, thermal, signal, mechanical and qualification requirements.
Product focus
Aerospace and UAV projects need a clear qualification boundary.
Flight profile, environmental exposure, configuration control, data handling and acceptance evidence are reviewed before a manufacturing route is released.
- Avionics, UAV flight-control and payload scope
- Configuration and traceability records
- Qualification and data-handling review
Standard PCB Specifications
Volume production capabilities for rigid and multilayer PCB
| Parameter | Specification |
|---|---|
| Layer Count | 1–40 Layers |
| Base Material | FR-4, High-Tg FR-4, halogen-free FR-4, Rogers, Taconic/AGC, PI, aluminum, PTFE/Teflon, F4B and other specialty laminates |
| Board Thickness | 0.10–10.0 mm |
| Min Trace Width / Spacing | 2.5 / 2.5 mil (0.0625 / 0.0625 mm) |
| Min Mechanical Drill | 0.15 mm |
| Min Laser Via | 0.10 mm |
| Standard Aspect Ratio | Up to 15:1 |
| Copper Thickness | 0.5–12 oz, depending on board type and construction |
| Min BGA Pad Diameter | 8 mil |
| Controlled Impedance | ±10% standard; ±5% for tighter requirements |
| Warpage | ≤0.75% standard; ≤0.5% available when specified |
| Surface Finishes | HASL, Lead-Free HASL, OSP, ENIG, Immersion Silver, Immersion Tin, ENEPIG, Hard Gold, Gold Finger and selective finishes |
Technical reference
UAV RF, HDI & Rigid-Flex Options
Compact flight electronics may require HDI, fine-pitch fanout, rigid-flex, RF material or back drilling. These construction choices are confirmed against the released UAV stackup, airframe interface and qualification plan.
Product focus
Aerospace and UAV projects need a clear qualification boundary.
Flight profile, environmental exposure, configuration control, data handling and acceptance evidence are reviewed before a manufacturing route is released.
- Avionics, UAV flight-control and payload scope
- Configuration and traceability records
- Qualification and data-handling review
Advanced Multilayer & HDI PCB
R&D prototyping and high-end HDI builds
| Parameter | Specification |
|---|---|
| Layer Count | Up to 64 Layers(Prototype / engineering builds) |
| Min Trace Width / Spacing | 2 / 2 mil (0.05 / 0.05 mm) |
| Standard Mechanical Drill | 0.15 mm |
| Advanced / Special Hole Capability | Down to 0.10 mm, subject to design and process review |
| Min Laser Microvia | 0.075 mm |
| Aspect Ratio | Up to 20:1 for qualified designs; 15:1 or below for standard advanced production |
| Controlled Impedance | ±10% standard; ±5% for tighter requirements |
| HDI Structures | 1+N+1, 2+N+2, multi-step HDI and Any-Layer HDI |
| Via Technology | Blind vias, buried vias, stacked vias, staggered vias, via-in-pad, VIPPO / POFV, resin-filled and plated-over vias |
| Sequential Lamination | Supported |
| Any-Layer Interconnection | Supported |
| Back Drilling | Supported |
| Warpage Control | ≤0.5% available when specified, subject to stack-up and design review |
| High-Speed / High-Frequency Materials | Rogers, Taconic/AGC, PTFE/Teflon, F4B, High-Tg FR-4 and other low-loss specialty laminates |
| Board Thickness Tolerance | ±0.05 mm |
| Thermal Conductivity | Up to 3.0 W/m·K(Aluminum PCB) |
Build detail
Materials for UAV & eVTOL Electronics
Material, finish, copper, coating and cleanliness decisions are reviewed against the customer’s approved list, thermal profile, signal requirements, airframe interface and acceptance documentation.
Scope options
Choose from the released requirement.
The final combination is confirmed during engineering review.
High-Tg TG170FR-4RogersTaconicPIRigid-FlexENIGENEPIGImmersion SilverOSPHard GoldConformal Coating
Review inputs
Keep this decision connected to the product.
- Avionics, UAV flight-control and payload scope
- Configuration and traceability records
- Qualification and data-handling review
Technical reference
Drone PCB Assembly for Flight-Control & Sensing
Fine-pitch processors, sensors, connectors, shields, power devices and mixed-technology content are assembled to the approved UAV flight-control BOM, drawings, workmanship class, inspection plan and test requirements.
Product focus
Aerospace and UAV projects need a clear qualification boundary.
Flight profile, environmental exposure, configuration control, data handling and acceptance evidence are reviewed before a manufacturing route is released.
- Avionics, UAV flight-control and payload scope
- Configuration and traceability records
- Qualification and data-handling review
PCB Assembly Specifications
SMT, THT and mixed technology assembly capabilities
| Parameter | Specification |
|---|---|
| Min Component Size | 01005 (0.4 × 0.2 mm) |
| Component Size Range | 01005 to 150 × 100 × 30 mm |
| Min BGA Pitch | 0.25 mm |
| Min QFP / QFN Pitch | 0.15 mm spacing / 0.3 mm width |
| Placement Accuracy (X/Y) | ±0.025 mm (±25 μm) |
| Placement Accuracy (θ) | ±0.2° |
| Max BGA Component Size | 70 × 74 mm |
| Max PCB Assembly Size | 400 × 1200 mm(Min 50 × 50 mm; applicable process-line envelope, subject to board support and panelization review) |
| PCB Thickness Range | 0.3–10.0 mm |
| Warpage Control | ≤0.5%(Subject to board construction and assembly process review) |
| Max Component Height | 120 mm(Applicable equipment and assembly route; confirm package clearance during engineering review) |
| Soldering Methods | Wave Soldering, Selective Soldering, Hand Soldering |
| Reflow Atmosphere | Air / Nitrogen(Nitrogen reflow on applicable lines; oxygen target depends on the assembly route and profile) |
| SMT Production Capacity | 700+ million points / month(Combined figure across 20+ SMT lines; not a per-facility or per-line guarantee) |
Design context
Aerospace and UAV projects need a clear qualification boundary.
Flight profile, environmental exposure, configuration control, data handling and acceptance evidence are reviewed before a manufacturing route is released.
- Avionics, UAV flight-control and payload scope
- Configuration and traceability records
- Qualification and data-handling review
Aerospace ElectronicsUAV ElectronicsAvionics BoardsQualification Review
Quality & evidence
UAV Quality, Configuration & Data Review
PCBArise can review project-specific inspection, electrical test, functional test, traceability, configuration, NDA and data-handling requirements. The applicable customer and legal requirements must be confirmed before release.
ISO 9001:2015ISO 14001:2015Configuration ControlNDA ReviewProject Acceptance Records
Released data
Revision, BOM, drawings and acceptance inputs are aligned before production.
Inspection route
Inspection and electrical or functional test scope follows the project plan.
Traceability
Required records are confirmed against the product and customer scope.
Change control
Material, process and configuration changes are reviewed before release.
Frequently asked questions
Questions to resolve before release.
These answers outline the information engineering needs to confirm the right manufacturing path.
Can you provide UAV PCB assembly for drone and eVTOL projects?
Yes. We can review drone, UAV, eVTOL, flight-control, sensing, power and communication electronics. The application, end use, materials, qualification, traceability, data handling and acceptance requirements are confirmed before quotation.
How are UAV PCB quality requirements reviewed?
The review can cover the operating environment, materials, workmanship, inspection, electrical or functional test, traceability, configuration control and project acceptance records. The final evidence plan follows the released design and customer requirements.
Do you support drone flight-control and eVTOL electronics?
We can review flight-control, navigation, telemetry, payload, sensing, power-management and communication boards for UAV and eVTOL programs. Send the released design, operating environment, qualification plan and acceptance criteria for an engineering assessment.
How do you handle UAV traceability and configuration control?
The required record set is defined by the project and can include the approved BOM and revision, component lots, inspection and test records, change history and shipment release evidence. The customer’s configuration and quality requirements govern the final process.
Can you support high-vibration UAV electronics?
We can review board construction, component support, connector interfaces, mechanical constraints, thermal conditions and test requirements against the project’s vibration and operating profile.
What should I send for a UAV PCB quote?
Send the released Gerber or ODB++ files, BOM, drawings, stackup, material and finish requirements, environmental profile, qualification and test plan, workmanship class, traceability and configuration requirements, end-use information, and any NDA or data-handling instructions.
Related PCB pages
Continue with the next engineering decision.
Move from industry requirements to the PCB, PCBA and quality pages that support the build.
PCBArise resource
High Reliability PCB
Quality, inspection, traceability, and acceptance planning.
PCBArise resourceRigid-Flex PCB
Compact interconnects for UAV assemblies.
PCBArise resourceHigh Frequency PCB
RF materials and controlled-impedance construction.
PCBArise resourcePCB Assembly Capabilities
Fine-pitch, mixed-technology, inspection, and test.
PCBArise resourceCertifications & Compliance
Applicable quality systems and project documentation review.
Define the aerospace and UAV PCB build scope.
Send the released design data, environmental profile, qualification plan and end-use requirements for a project-specific review.